Provided by: thermald_1.1~rc2-11_amd64 bug


       thermal-conf.xml - Configuration file for thermal daemon




       thermal-conf.xml  is  a configuration file for the thermal daemon. It is used to configure
       thermal sensors, zone and cooling  devices.The  location  of  this  file  depends  on  the
       configuration option used during build time.

       The  terminology used in this file confirms to "Advanced Configuration and Power Interface
       Specification". The ACPI thermal model is based around conceptual platform regions  called
       thermal  zones that physically contain devices, thermal sensors, and cooling controls. For
       example of a thermal zone can be a CPU or a laptop cover.  A  zone  can  contain  multiple
       sensors  for  monitoring  temperature.  A  cooling device provides interface to reduce the
       temperature of a source device, which causes increase in the temperature. An example of  a
       cooling device is a FAN or some Linux driver which can throttle the source device.

       A  thermal  zone  configuration  includes  one  or  more  trip  points.  A trip point is a
       temperature at which a cooling device needs to be activated.

       A cooling device can be either active or passive. An example of an active device is a FAN,
       which will not reduce performance at the cost of consuming more power and noise. A passive
       device uses performance throttling to control temperature. In addition to cooling  devices
       present  in  the thermal sysfs, the following cooling devices are built into the thermald,
       which can be used as valid cooling device type:

            - rapl_controller

            - intel_pstate

            - cpufreq

       The thermal sysfs under  Linux  (/sys/class/thermal)  provides  a  way  to  represent  per
       platform  ACPI  configuration.  The  kernel  thermal  governor  uses this data to keep the
       platform thermals under control. But there are some limitations, which thermald  tries  to
       resolve. For example:

       - If the ACPI data is not optimized or buggy. In this case thermal-conf.xml can be used to
       correct the behavior without change in BIOS.

       - There may be thermal zones exposed by  the  thermal  sysfs  without  associated  cooling
       actions.  In  this  case  thermal conf.xml can be used to tie the cooling devices to those

       - The best cooling method may not be in the thermal sysfs. In this  case  thermal-conf.xml
       can be used to bind a zone to an external cooling device.

       -  Specify thermal relationships. A zone can be influenced by multiple source devices with
       varying degrees. In this  case  thermal-conf.xml  can  be  used  to  define  the  relative
       influence for apply compensation.


       The  configuration  file  format  confirms to XML specifications. A set of tags defined to
       define platform, sensors, zones, cooling devices and trip points.



            <Name>Example Platform Name</Name>

            <!--UUID is optional, if present this will be matched. Both product name and UUID can
       contain wild card "*", which matches any platform.-->

            <UUID>Example UUID</UUID>

       configuration  file format confirms to XML specifications. A set of tags defined to define
       platform, sensors, zones,  cooling
                     devices and trip points.



                   <ProductName>Example Product Name</ProductName>


            <!-Quiet mode will only use passive cooling device. "PERFORMANCE"  will  only  select
       active devices .-->



                      <!-- New Sensor with a type and path -->






                      <!-- Already present in thermal sysfs, enable this or add/change config For
       example, here we are indicating that sensor can do async events to avoid polling


                      <!-- If async capable, then we don't need to poll -->






                      <Type>Example Zone type</Type>




                                <!-- Temperature at which to take action -->

                                <Temperature> 75000 </Temperature>

                                <!-- max/passive/active If a MAX type is specified,  then  daemon
       will use PID control to aggressively throttle to avoid reaching this temp.-->


                                <!--  SEQUENTIAL  | PARALLEL. When a trip point temp is violated,
       then number of cooling devices can be activated. If control type is  SEQUENTIAL  then,  it
       will exhaust first cooling device before trying next. -->





                                     <!--  Influence  will  be  used order cooling devices. First
       cooling device will be used, which has highest influence. -->

                                     <influence> 100 </influence>

                                     <!-- Delay in using this cdev,  this  takes  some  time  too
       actually cool a zone -->

                                     <SamplingPeriod> 12 </SamplingPeriod>








                      <!-- Cooling device can be specified by a type and optionally a sysfs path.
       If the type is already present in thermal sysfs, there is no need of a path.  Compensation
       can  use  min/max and step size to increasing cool the system. Debounce period can be used
       to force a waiting period for action. -->




                      <ReadBack> 0 </ReadBack>



                      <!-- If there are no PID parameters, compensation increase  step  wise  and
       exponentially (if single step is not able to change trend). Alternatively a PID parameters
       can be specified then next step will use PID calculation using provided PID constants. -->